Solder Matching Laser Soldering Process

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Intoduction

Solder balls are a key component in semiconductor packaging technologies such as BGA and CSP, as well as in other soldering processes. They are technology-intensive products that transmit electrical signals by connecting chips to motherboards. We can provide solder balls as small as 50um, and also offer customized options.

NameCompositionMaterialHigh roundnessLow oxygen contentCPK high CPK
SAC305 Lead-free solder ball SAC305Sn96.5Ag3.0Cu0.5Sn, Ag, Cu≥95%0≥1.33
Lead solder ballSn63Pb37Sn, Pb/0.005%–0.01%≥1.67
Gold solder ballAu80% Sn20%Au, Sn≥95%26ppm≥1.33
Specification (mm)0.20.250.30.350.40.450.50.550.600.650.760.891.01.21.31.5
Narrow dimensional tolerance (um) (Lead-free)±10±10±10±10±10±10±15±15±20±20±20±20±50///
Quantity      25万     15万6万4万2万