Heat Pressing Welding
Category: ssv1
Intoduction
Functional Features
- The heating can be adjusted according to different products; the welding head made of special materials ensures even pressure distribution on the product;
- Equipped with a vacuum function, making alignment adjustment easier; temperature is digitally controlled, ensuring clarity and precision;
- Equipped with a digital pressure gauge, with preset pressure range; microcomputer control, precise and stable;
- Programmable cursor heating and cooling drives include preset temperatures;
- Suitable for various high-density TAB, TCP crimping, as well as solder crimping of FPC, FFC, and PCB;
- Adopt precise PID control, replacing pulse drive with phase angle;
- Low vibration, low noise, and stable voltage; real-time display of temperature value and temperature data;
- Input data through touch screen, simplifying operation.
Technical parameters
| Specifications | ABT-RY500 |
|---|---|
| Equipment size | 660×660×700mm |
| Workbench size (mm) | Max 200×170mm |
| Machine weight (KG) | 75 |
| Working pressure (Mpa) | 0.6-0.80 (Mainly used for solder joint cooling) (Standard 0.7Mpa) |
| Working power supply | AC220V±10%, 50HZ, 2KVA |
| Heating setting | Two sections |
| Work environment | 10-60℃, 40%-95% |
| Weld pressure | 1~20Kg |
| Temperature setting | RT~500℃ error ±5℃ |
| Weld time | 1-99.9S (Settable) |
| Hot pressing accuracy | Pitch 0.2mm |
| Thermal compression head size (mm) | MAX 60×33mm |
| Hot press fixture | 1个 |
| Alignment method | CCD+LCD display |
| Material release method | Manual handling |
| Start method | Two-hands control |
| Heating method | Pulse heating, with a rise time of 1-2 seconds |
| Push pull platform | Cylinder control, error <0.02mm |
Application Area
Suitable for various high-density TAB, TCP crimping, as well as solder crimping of FPC, FFC, and PCB
