This equipment is based on electromagnetic induction heating technology, equipped with a three-axis motion platform and temperature control system, capable of soldering thick-plate through-hole pin devices, surface-mount components, and deep-buried heterogeneous structures. It has a wide range of applications, short soldering time, and high efficiency.
applications
â—† One device is compatible with welding of multiple products â—† Thick plate welding of through-hole components â—† Welding of surface components â—† Welding of deep buried holes and interlayer solder joints
