Solder Paste

Category:

Intoduction

Solder paste is an important connecting material in the surface mount technology (SMT) of circuit boards. To select a suitable solder paste, factors such as alloy content, alloy composition, solder powder particle size, and flux type need to be comprehensively considered.

Main types

Laser solder paste, jet solder paste, Mini LED solder paste, LED die bonding solder paste

NameSpecification ParametersNameSpecification Parameters
Alloy compositionSn96.5Ag3.0Cu0.5packaging specificationEFD
Product modelABT-J-200Minimum order quantity10g/branch, 20g/branch30g/branch, 50g/branch
(#) Solder powder size4# (20-38μm)5# (10-28μm)6# (5-15μm)Storage temperature requirement100克
Packaging form1-10℃--