Solder Paste
Category: ssv1
Intoduction
Solder paste is an important connecting material in the surface mount technology (SMT) of circuit boards. To select a suitable solder paste, factors such as alloy content, alloy composition, solder powder particle size, and flux type need to be comprehensively considered.
Main types
Laser solder paste, jet solder paste, Mini LED solder paste, LED die bonding solder paste
| Name | Specification Parameters | Name | Specification Parameters |
|---|---|---|---|
| Alloy composition | Sn96.5Ag3.0Cu0.5 | packaging specification | EFD |
| Product model | ABT-J-200 | Minimum order quantity | 10g/branch, 20g/branch30g/branch, 50g/branch |
| (#) Solder powder size | 4# (20-38μm)5# (10-28μm)6# (5-15μm) | Storage temperature requirement | 100克 |
| Packaging form | 1-10℃ | - | - |
