Solder Matching Laser Soldering Process
Category: ssv1
Intoduction
Solder balls are a key component in semiconductor packaging technologies such as BGA and CSP, as well as in other soldering processes. They are technology-intensive products that transmit electrical signals by connecting chips to motherboards. We can provide solder balls as small as 50um, and also offer customized options.
| Name | Composition | Material | High roundness | Low oxygen content | CPK high CPK |
|---|---|---|---|---|---|
| SAC305 Lead-free solder ball SAC305 | Sn96.5Ag3.0Cu0.5 | Sn, Ag, Cu | ≥95% | 0 | ≥1.33 |
| Lead solder ball | Sn63Pb37 | Sn, Pb | / | 0.005%–0.01% | ≥1.67 |
| Gold solder ball | Au80% Sn20% | Au, Sn | ≥95% | 26ppm | ≥1.33 |
| Specification (mm) | 0.2 | 0.25 | 0.3 | 0.35 | 0.4 | 0.45 | 0.5 | 0.55 | 0.60 | 0.65 | 0.76 | 0.89 | 1.0 | 1.2 | 1.3 | 1.5 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Narrow dimensional tolerance (um) (Lead-free) | ±10 | ±10 | ±10 | ±10 | ±10 | ±10 | ±15 | ±15 | ±20 | ±20 | ±20 | ±20 | ±50 | / | / | / |
| Quantity |  |  |  |  |  |  | 25万 |  |  |  |  |  | 15万 | 6万 | 4万 | 2万 |
