Solder Ball Mounting Machine
Intoduction
This equipment utilizes laser as the heat source, fully leveraging the excellent directionality and high power density of the laser beam. Through the optical system, the laser beam is focused on a very small area, forming a localized area with high heat concentration in a short period of time. The melted solder balls are sprayed onto the surface of the product to complete the ball placement.
Equipment Advantage
â—† High-precision motion control, with a repeatability accuracy of +10 micrometers
â—† Visual positioning accuracy of 5 um
â—† High-precision laser energy control system, with an error margin of +3%
â—† Consistent Performance, with an error of +20 um
â—† Fewer cavities, high reliability
â—† It can be equipped with a marble platform for stable and earthquake-resistant performance
applications
Suitable for ball placement and BGA chip packaging in various WLP processes.
Technical parameters
| Item | Parameters |
|---|---|
| model | ABT-PLS 350CH |
| Laser parameter | power: 75 Or 150 W |
|  | wavelength: 1064±10 nm |
| Solder ball | φ 0.06 mm–2.0 mm |
| Control system | PLC + PC |
| Mechanical repetition precision | ±10 um |
| Visuallocation system | CCD: 5 M pixels |
|  | Resolution: ±5 um |
| Power Source | AC 220V |
| Power consumption | 2.5 KW |
| Compressed gas | 0.6 MPa, Nitrogen: 20.4 MPa, purity ≥99.99% |
| Nitrogen consumption | 1.0 M³/H |
| Pallet size | 200 × 150 mm (Customizable) |
| Dimension | 1200 × 1200 × 1800 mm |
| Net weight | 800 Kg |
