GDSK-S2000 3D SOLDER PASTE INSPECTION
Key Features
- Comprehensive Inspection Capability for Area, Volume, Height, Offset, Bridging, Shape Deformity, and Missing/Excess Solder Paste
- Advanced 3D Grating Projection & Phase Modulation Profilometry Technology
- High-Speed Digital CCD Camera for Accurate Inspection
- Optical Resolution up to 15–20 μm (Depending on Field of View)
- High-Precision Height Measurement Accuracy up to ±1 μm
- Supports PCB Sizes from 50 × 50 mm to 650 × 650 mm
- Advanced PCB Warp Compensation up to ±3.5 mm
- Measures Solder Paste Heights up to 400 μm
- Fast and Reliable Detection of Printing Defects
- Suitable for High-Speed SMT Production Lines
